Half-Length PCI Express Card with TI 66AK2H12 and TMS320C6678 DSPs
- One 66AK2H12, one TMS320C6678 and one XC7K70T FPGA on single halflength PCI Express Card with PCIe Gen2 x2 interface to the edge connector
- Four ARM Cortex-A15 @ 1.4GHz and Eight TMS302C66x™ DSP Core Subsystems (C66x CorePacs) @ 1.2GHz of 66AK2H12
- Eight TMS302C66x™ DSP Core Subsystems (C66x CorePacs) @ 1.25GHz of TMS320C6678
- Supports dual SDI-3G input & output and single HDMI 1.3a input
- Supports XDS200 and XDS560v2 evaluation module via JTAG for CCS connection
- Supports new video standards HEVC/H.265 & H.264 codec
- For video acquisition, encode, decode, transcode, analytic & streaming applications
The DSP-8683 integrates Texas Instruments 66AK2H12 and TMS320C6678 multicore processors based on the KeyStone architecture, and a Xilinx Kintex-7 XC7K70T FPGA device to provide the highest computing performance and flexibility in a half-length PCIe form factor for supporting a wide range of applications. The built-in 16 TI C66x DSP cores and 4 ARM Cortex-A15 cores offer unrivalled processing capabilities for data and control plane processing while the reprogrammable Xilinx Kintex-7 FPGA device adds flexibility to the
design by allowing the inclusion of customized hardware functions.
Video acquisition is achieved through SDI-3G input/output and HDMI input connectors facilitating connectivity to external devices for video processing. The Gigabit Ethernet and USB3 interfaces can be used for data streaming between the DSP-8683 and remote systems. A unique standalone operation mode enables the DSP-8683 to be operated as an autonomous embedded system without the involvement of an additional host processor card or motherboard, allowing
highly cost effective deployment. An innovative and unique, dedicated board-to-board interconnect offers the possibility of synchronizing multiple DSP-8683 cards over dedicated high-speed serial interfaces. All these unprecedented features make the DSP-8683 ideal for new video standards (such as HEVC/H.265) in broadcasting, machine vision, medical imaging, cloud computing, and mission critical applications among others.