| Description |
| ‧ |
Supports Intel® Core™ Duo low voltage or Core™ 2 Duo Ultra low voltage mobile processor |
| ‧ |
Intel® 945GME chipset supports 533/667 MHz FSB |
| ‧ |
Up to 3 GB (DDR2 533/667) memory with SODIMM expansion |
| ‧ |
Conduction cooled with ANSI/VITA30.1-2002 compliancy |
| ‧ |
Boot from network, Compact Flash |
| ‧ |
Pre-heat circuitry for reliable cold-booting in low temperature environment |
| ‧ |
Conformal coating |
| ‧ |
PICMG 2.16 R1.0, PICMG 2.1 R2.0, PICMG 2.6 R1.0 compliant |
|
| ‧ |
Supports Intel® Core™ Duo low voltage or Core™ 2 Duo ultra low voltage mobile processor |
| ‧ |
Intel® 945GME chipset supports 533/667 MHz FSB |
| ‧ |
Up to 3 GB (DDR2 533/667) memory with SODIMM expansion |
| ‧ |
IPMI v1.5 |
| ‧ |
Boot from network, CompactFlash, or local 2.5” SATA HDD |
| ‧ |
One VGA port and two USB 2.0 ports to front panel |
| ‧ |
Optional conformal coating and SODIMM gluing service |
| ‧ |
PICMG 2.16 R1.0, PICMG 2.1 R2.0, PICMG 2.6 R1.0 compliant |
|
| ‧ |
External rear-panel interface connectors for the MIC-3392MIL CPU board |
| ‧ |
On-board battery |
| ‧ |
Supports SATA, IDE, FDD, LPT, USB2.0, COM, and audio interfaces |
| ‧ |
4 RJ-45 ports on the real panel |
| ‧ |
2 DVI-I ports on the rear panel |
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